AI and liquid cooling in data centers

22.08.2024

ChatGPT and other AI tools are transforming our daily lives. High-Performance Computing (HPC) as well as powerful GPUs and TPUs are needed to handle the complex computations. However, traditional air cooling has reached its limitations. What are the next cooling technologies?

Data centers need liquid cooling primarily due to the limitations of traditional air-cooling systems in handling the high heat densities generated by modern, high-performance computing equipment.

Current liquid cooling technologies for data centers are designed to efficiently manage the heat generated by HPCs. Prominent liquid cooling technologies are direct to chip, spray cooling and immersion cooling which can be used in different conditions.

In terms of power density, energy efficiency, space constraints, maintenance costs and compatibility with hardware different liquid methods can be considered.

SuP evaluated global data center cooling technologies and identified hybrid solutions, combining air cooling with direct to chip methods, will dominate the market until 2030. Afterwards, immersion cooling is expected to gradually increase its market share. This shift is attributed to immersion cooling’s advancements in efficiency, which are becoming increasingly vital with the rise of AI development.

Are you interested in further information?
Please do not hesitate to contact us:
Xinglin Wang
Phone: +49 6201 9915 13,
xinglin.wang@SchlegelundPartner.de